300mm wafer cassette-less cleaning system
Achieved 65nμm / 5 pieces of high purity! Inserted 25 pieces into the gaps of 25 Wf, halving the pitch and processing 50 pieces at once.
The "300mm Cassette-less Wafer Cleaning System" is a product used in the chemical polishing process after final polishing. It accommodates 25 wafers in the gaps of 25 wafers, arranged in a half-pitch, allowing for the simultaneous processing of 50 wafers, achieving a high cleanliness level of 65nμm/5 pieces. 【Main Specifications】 ■ Items to be cleaned: 300mm thickness 0.75t ■ Processing method: Cassette-less dip processing ■ Processing speed: 50 pieces/5 min (variable) ■ Cleanliness inside the device: 0.1μm Class 1 ■ Pass line: FL+900±5mm manual set by hoop ■ Transport method: Front transport *For more details, please refer to the PDF document or feel free to contact us.
- Company：株式会社ダン科学 入間営業所
- Price：Other
